EN
- Overview
- Recommended Products
- Hydroxymethyl Modification: The polarity of hydroxyl groups and intermolecular hydrogen bonding affect the melting point, solubility, and dispersion behavior of the compound in resin systems.
- High Latency: Exhibits almost no reaction with epoxy resin at room temperature, providing a long pot life for one-component systems, while enabling rapid curing upon heating.
- Improved Adhesion and Filler Dispersion: The hydroxyl groups within the molecule can improve adhesion and filler dispersion, making the compound particularly valuable for underfill materials and highly filled systems.
- Semiconductor encapsulation molding compounds (EMC)
- Chip bonding materials
- Underfill materials
- FR-4 copper-clad laminates
- One-component epoxy adhesives and bonding agents
- Powder coatings
- Dispersion Processing: As a solid powder with a melting point of 204°C, 2P4MHZ requires attention to dispersion when added to liquid epoxy systems. Grinding or melt blending may be necessary to prevent agglomeration.
- Dosage Control: Exceeding the recommended dosage limit does not provide additional acceleration benefits and may instead shorten the storage life of the system.
- Safe Handling: GHS information indicates that the product is harmful if swallowed and may cause irritation to the eyes, respiratory tract, and skin. Wear protective gloves and safety goggles, and ensure adequate ventilation during handling.
1. Product Overview
2P4MHZ is a highly latent curing accelerator for one-component thermosetting epoxy systems. The introduction of hydroxymethyl groups not only changes the physical properties of the molecule but also improves adhesion and dispersion within the system through interactions between hydroxyl groups and epoxy groups or filler surfaces.
Typical applications include semiconductor encapsulation molding compounds (EMC), chip bonding resin pastes, underfill materials, FR-4 copper-clad laminates, and high-Tg prepregs.
2. Basic Information and Physical Properties
Item |
Parameter |
Chinese Name |
2-Phenyl-4-methyl-5-hydroxymethylimidazole (also known as 4-Hydroxymethyl-5-methyl-2-phenylimidazole) |
English Name |
2-Phenyl-4-methyl-5-hydroxymethylimidazole |
Trade Name |
2P4MHZ |
CAS No. |
13682-32-1 |
EC No. |
237-187-5 |
Molecular Formula |
|
Molecular Weight |
188.23 |
Appearance |
White to pale yellow crystalline powder |
Melting Point |
204°C |
Boiling Point |
446.1°C |
Solubility |
Sparingly soluble in water, toluene, xylene, and similar solvents; slightly soluble in methanol and DMF |
