EN
1. Product Overview
2MA-OK is a 1:1 molecular adduct of 2,4-diamino-6-[2-(2-methylimidazol-1-yl)ethyl]-1,3,5-triazine and trimeric isocyanuric acid (isocyanuric acid).
The imidazole ring in its molecular structure provides curing catalytic activity, while the addition of isocyanuric acid achieves a room-temperature "activity-locking" effect. Through ionic bonding, the active sites are effectively locked, providing excellent latency.
As a typical latent imidazole-based epoxy curing agent, 2MA-OK is widely used in one-component epoxy systems, electronic encapsulation and potting, copper-clad laminates, PCB solder mask inks, powder coatings, adhesives, and laminated materials.
It is particularly suitable for one-component latent formulations that require both excellent storage stability and rapid curing performance.
2. Basic Information and Physical Properties
Item |
Value / Status |
Chemical Name |
Compound of 1,3,5-Triazine-2,4,6(1H,3H,5H)-trione |
English Name |
1,3,5-Triazine-2,4,6(1H,3H,5H)-trione, compd. with 6-[2-(2-methyl-1H-imidazol-1-yl)ethyl]-1,3,5-triazine-2,4-diamine |
CAS Number |
68490-66-4 |
Molecular Formula |
C₁₂H₁₆N₁₀O₃ |
Structural Formula |
|
Molecular Weight |
348.32 |
Appearance |
White to off-white powder |
Melting Point |
≥260°C |
Activation Temperature |
130°C |
Solubility |
Slightly soluble in water and ethanol; poorly soluble in common organic solvents |
3. Product Features and Recommended Applications
Product Features
- Excellent Cured-Material Performance: High heat deflection temperature (HDT) and glass transition temperature (Tg), along with excellent chemical resistance, electrical insulation, and mechanical properties. It offers relatively high curing activity and can achieve curing within a short period under medium-temperature conditions.
- Good Compatibility with Anhydrides and Dicyandiamide (DICY): In addition to serving as a primary curing agent, it can also be used as a curing accelerator for anhydride or DICY systems, significantly improving the performance of epoxy resin formulations.
- Good Heat Resistance and Surface Appearance: The molecular structure contains a triazine ring, contributing to good heat resistance and a glossy appearance of the cured material.
- Excellent Latency: Provides a room-temperature latency period of 3–5 months, making it an ideal latent curing agent for one-component epoxy systems.
- Curing Temperature Window: 120–140°C. Moderate curing activity at 120–125°C and relatively high activity at 125–140°C.
- Coating System Performance: Offers a long pot life and better storage stability than 2MZ-A. It exhibits very slight yellowing or no yellowing.
Recommended Applications
- Epoxy Resin Applications: Latent curing agent/accelerator for one-component epoxy systems, including electronic encapsulation and potting applications.
- Powder Coatings and Adhesives: Particularly effective in powder coating and adhesive formulations.
- Other Applications: Copper-clad laminates (CCL), concrete, laminated materials, electronic inks, and PCB solder mask inks.
